Partners and Collaborators
HyperCool2™ system for direct contact evaporative cooling (DCEC) is powered by 3M™ Novec™ 7000 Engineered Fluid and is being deployed by partners such as CEI Modular. Unlike water-based direct-to-chip solutions, where the risk of IT failure is possible due to leakages, the system leverages 3M Novec fluid, which mitigates this issue via its non-conductive properties. 3M Novec fluids for direct-to-chip cooling in data centers can help increase server performance while reducing overall energy consumption compared to incumbent cooling methods.
A recognized leader in the liquid cooling revolution for data centers, 3M manufactures Novec fluids that are engineered to efficiently absorb heat generated by electronic components, reducing the need for electrically-driven cooling components.
As high-performance computing cooling demands increase and air solutions reach their limit, operators are struggling with effective cooling solutions that do not involve water, which could lead to risk of IT meltdown. By incorporating ZutaCore’s direct-on-chip, two-phase, waterless liquid cooling solution into its modular data center designs, CEI Modular is revolutionizing the data center. With the HyperCool2TM inside, CEI Modular is shrinking the data center footprint up to 40 percent, simplifying design, streamlining installation and densifying computing. ZutaCore’s liquid cooling solution is the latest technology in CEI Modular’s portfolio of modular data center designs.
The HyperCool² is a waterless, direct-on-chip liquid cooing system. Integrating the Intel® Data Center Manager (Intel® DCM) into ZutaCore's software-defined-cooling (SDC) platform enables virtualization of cooling assets, predictive operations and optimization.
Rittal, a leading global systems provider, has partnered with ZutaCore to bring to market Rittal HPC Cooled-by-ZutaCore solutions to address demands from hyperscale and colocation companies to cool processors up to and above 900W, and at higher densities. Combining Rittal’s trusted, scalable IT racks with ZutaCore’s pioneering waterless, two-phase liquid cooling technology, alleviates cooling boundaries from hot spots to the edge, while also mitigating the risk of IT failure. Now data center owners and operators can harness computer power at significantly higher densities from the CPU level through to server, rack and data center levels, consistently, in any climate.
UNIXPlus, an established IT system integrator and ZutaCore, are working together to provide retrofitted and warrantied servers cooled-by-ZutaCore. Together, they address a rapidly increasing pain point for data center operators struggling to improve heat dissipation for dynamic, high performance computing applications – the limitations of existing cooling technologies. Customers are looking for innovative technology partners to retrofit their infrastructure without the fear of breaching warranties. UNIXPlus is the first integrator to provide an extended warranty for servers retrofit with ZutaCore’s HyperCool2TM technology.
Now, clients can overcome cooling restrictions from traditional air or risky water solutions and achieve unparalleled heat dissipation. ZutaCore’s HyperCool2TM will support higher computing densities, in compact footprints while slashing data center Power Usage Effectiveness (PUE) and reducing costs. This pivotal technology enables data center operators to go beyond LEED Platinum levels.