Designed by a veteran team in Israel and enabled by 14 patent-pending innovations, HyperCool²™ alleviates cooling boundaries at the chip, server, rack, POD and data center levels. At its core is the direct-on-chip Enhanced Nucleation Evaporator (ENE), a single, closed-loop, two-phase, waterless liquid cooling solution that yields unparalleled heat dissipation at the chip level. Unlike water-based solutions, HyperCool² leverages a safe, non-conductive, refrigerant. It is a complete hardware system, enhanced by a software-defined-cooling platform. Combined it is a low-pressure system that triples computing densities on a third of the footprint consistently, in any climate. By reducing the design to commissioning cycle and halving costs, return on investments are accelerated and real estate assets maximized.
- High power CPUs/GPUs
- Server hotspots
- High performance computing applications
- Artificial Intelligence & Machine Learning
- 5G networks
- Autonomous vehicles
- High power density racks & DC
- DC retrofits, new builds and EDGE computing
The HyperCool² System is Comprised of:
Industry leading cooling efficiency with mass flow of 2.5KG and ∆T<1ºC.
Cooling on demand
Self-regulated, each chip receives the exact amount of cooling it needs, maintaining a constant temperature.
Low-Pressure System with Two-Phase Heat-Exchange
Closed, single-loop, low-pressure and low flow rate, with minimal volume of refrigerant.
Use of industrial refrigerants - safe, green, non-conductive, non-toxic, currently with 3M’s Novec-7000.
HyperCool² is a complete hardware system, enhanced by a software-defined-cooling platform, for cooling assets virtualization, predictive operations and optimization.